Next month (July 9-11) MASER Engineering will be present at the 16th Global X-ray & CT Forum in Hannover, Germany. As a frequent user of X-ray techniques on electronics, MASER Engineering is very experienced in this area and therewithal willing to show a part of our expertise at this Forum. You can find our managing director Kees Revenberg on Wednesday 11th of July presenting “The role of X-ray and CT in Failure Analysis of Integrated Circuits and Electronic Modules”.
Modern Integrated Circuits will become more complex packages or even System in a Package modules. In case of a failure, the analysis procedure starts with a non-destructive flow. X-ray microscopy is an important tool in the initial steps, among other techniques. In quite some cases it prevented the destructive removal of the fault location before it was known. This presentation will highlight the day-by-day 2D and 3D X-ray applications in F/A laboratory. Complementary techniques are presented too.
An overview of future packaging trends will demonstrate the challenges in X-ray microscopy where it should maintain its role in the F/A flow of advanced IC packages. More information about this inimitable topic to be discovered during “The role of X-ray and CT in Failure Analysis of Integrated Circuits and Electronic Modules”.
We are looking forward to meet you at the 16th Global X-ray & CT forum. Please visit the Industrial X-ray & CT Forum website for more information about this topic and many more.